Agilent Technologies Option H48 Multiport Test Set Z5623A Specifications Page 3
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安捷倫科技高頻元件量測研討會
2/23/2006
Page 3
Bio tech / New form chip
IC/module/
System Design
High speed/high frequency
High thermal / Stress solution
Fab/fabless
Copper wafer
Low K material
12” wafer
Naro meter tech
Front/Back end
solution
Environment friendly
Compact Size
Low power consumption
Integrated
System
Low cost
Short Time to
Market
Worldwide strategy
Semiconductor
Industry
Interesting Semiconductor
World
安捷倫科技高頻元件量測研討會
2/23/2006
Page 4
Packaging Technology Trend
Single Chip Package
Stacked Package
Flip Chip
Stacked Die
1995
2000 2005
2010
QFP
Multiple Chip Package
BGA
MCM
FC+WB
System in Package
Laminate
2 & 4 Layer
Build-Up
Substrate
Multi-Layer
PCB
Chip
Functional Substrate
(Active & Passive Chip)
PiP
PoP
Wire Bond
Wire Bond + FC Bond
New
Interconnection?
- 安捷倫科技高頻元件量測研討會 1
- Packaging Development 2
- Trend of Integrated 2
- Analysis 2
- Interesting Semiconductor 3
- Why SIP ? 4
- Die Stacking Package Trend 4
- PoP and PiP 5
- Fine Pitch Wire Bonding 5
- Analysis Case I : 7
- Analysis Case II : 9
- Analysis Case IV : 10
- Analysis Case V : 11
- Website: www.aseglobal.com 14
- Thank You For Your Listening 15
- PNA Based Solutions 16
- • Saves battery power 18
- Pulsed Antenna Test 19
- Radar and Electronic-Warfare 20
- VNA Pulsed-RF Measurements 21
- VNA data display 22
- Note: PNA controls timing 23
- Using Wideband Detection 24
- Time domain 25
- Frequency domain 25
- Typical Hardware Setup 26
- (Narrowband) 26
- COTS stand alone hardware 27
- Comparing the 8510 and PNA 28
- CTS-I Family 29
- CTS-II Family 29
- Z5623A Hxx RF Modulators 30
- • Average pulse measurements 31
- Advantage: pulsed bias to 34
- 10 MHz Ref 35
- Resources 36
- Target Applications 37
- Diversity Rx 38
- WLAN FEM（2.4G・５G dual band） 39
- UMTS1900 40
- (Available December 2005) 41
- PNA/PNA-L Option 550 42
- Variety Summary 42
- Test Sets Overview 43
- Platform 43
- Description Benefits 43
- Multiport Specials – Variety 44
- •Extension Test Sets 44
- • Hybrid Test Sets 45
- • Switching Test Sets 45
- Multiport Special 48
- Multiport Qualification 49
- Information Sources 50
- Ming-Fan, Tsai 51
- Overview 52
- Interconnects 54
- Legacy Backplane System 56
- TDR and VNA Techniques 57
- Microprobing on SMA Pads 58
- Port 2Port 1Port 2Port 1 61
- Conclusions 63
- • length is different 66
- TDR or VNA 68
- FREE Agilent Email Updates 70
- Z Impedance? 71
- Short Termination 72
- Open Termination 72
- Perfect Termination 73
- Impedance Mismatch Terms 73
- Mismatch Exercise 74
- T = transit time 75
- Series R-C 77
- Shunt R-C 77
- Introducing 86100C option 202 79
- - TDR S-Parameters capability 79
- What is Normalization? 82
- University (Bracewell 82
- Transform) 82
- Critical for Rambus! 82
- Fixture DUT 83
- Comparison of TDR and PNA 84
- TDR vs VNA comparison 85
- N1024A TDR Calibration Kit 86
- Diff. TDR Probe 87
- TDR Accessories 87
- At 9 ps step speed, we see 5 90
- Each event is easily seen 90
- Optimizing 91
- Configuring a system 91
- •Extensive Calibration 92
- •Eye diagram simulation 92
- •N5320A-225 20G VNA 92
- •N5320A-240 20G VNA 92
- •54754Ax2 TDR base 92
- Clock Frequency (MHz) 95
- Simulation Leadership 97
- From Touchstone to ADS 98
- ADS for Signal Integrity 98
- Typical SI Problem 100
- Simulators 101
- Measurements 101
- Agilent Ptolemy 102
- Link Level Simulation 103
- Transmitter with Pre-Emphasis 104
- Channel Model 104
- Channel Subnetwork 105
- Interconnect Models 106
- EM Models - Momentum 106
- Momentum RF 107
- Quasi-Static Electromagnetics 107
- Comparison of Models 107
- Pre-emphasis 108
- Encoding/Decoding 108
- Source descriptions 108
- Integration of other Models 109
- Measurement-based Models 110
- Probing Solution + PLTS + ADS 110
- Bringing it All Together 111
- Signal Integrity Resources 111
- –Length – 2 days – hands-on 113
- Using ADS for Signal 114
- Integrity Design 114
- Wireline Applications 115
- IBIS Library 117
- Signal Integrity Applications 118
- TDR Simulation Instrument 118
- FrontPanels: Eye Diagram 121
- Oscilloscope Mode 122
- Eye/Mask Mode 123
- Receiver 125
- Example Test Board 126
- Create Models from Data 127
- DCA/BERT Measurement Setup 127
- Simulation 128
- DCA Measurement of BERT 129
- Simulation with Measured Data 129
- IBIS Model 130
- Importing IBIS Component 132
- Installation of design kit 133
- IBIS design kit components 133
- Pin Number 134
- V_fixture 134
- Momentum 135
- Digital Board Interconnect 137
- Advanced Calibration 139
- Techniques and Fixturing 139
- Issues for VNAs 139
- Agilent Technologies Ltd 139
- Course Goal 140
- Objectives 140
- “Hawaii” 140
- What’s Totally New in 6.0… 141
- What’s New in 6.0 From 5.0… 141
- Old Calibration Paradigm 143
- New Calibration Paradigm 144
- Old Calset File Location 145
- New Cal File Locations 145
- Limited Instrument State 146
- Extended Instrument State 146
- Pointer to Calset 146
- Error Terms 146
- Receiver calibration 147
- What is a “Delta Match” cal? 148
- Test port 2 149
- Test port 1 149
- Delta Match Cal 151
- When is Delta Match Used? 151
- Global Delta Match 152
- User Delta Match 152
- Using 2-Port ECal Modules 153
- Cascade’s WinCal 2006 157
- Frequently Asked Questions 158
- TRL Summary 158
- • Auto port extensions 159
- • Embedding/de-embedding 159
- • Measuring fixtures/probes 159
- Non-Insertable ECal Modules 160
- Unknown Thru to the Rescue! 161
- Unknown Thru Algorithm 161
- 1-port calibrations 162
- Unknown thru 162
- Cable Movement Error 163
- (Usual Way) 164
- (Unknown Thru) 165
- CABLE MOVEMENT 166
- Different connector 167
- Finish multiport cal 167
- 1.85 f-f adapter comparison 168
- 3. Higher-order modes 169
- Fixture And Probe Techniques 170
- Probe Probe 171
- Offset Load Definition 172
- Offset Load Class Assignments 172
- Thru Loss Definition 173
- Error Correction Choices 174
- Coaxial calibration 175
- Measurement Results 176
- Which Standards Should I Use? 178
- Broadband APE Example 178
- Narrowband APE Example 179
- Adjusting for Mismatch 179
- Active Span or Active Marker 180
- Loss at DC 180
- Fixturing for the Masses 182
- Order of Fixturing Operations 182
- Port Matching 183
- Differential Port Matching 183
- Port Z (Impedance) Conversion 184
- 2-Port De-Embedding 185
- 4-Port Embedding/De-Embedding 185
- Answer: Crosstalk terms! 186
- On-wafer SMC Measurements 187
- Unknown thru and DUT 189
- 2-port calibration 190
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